I made some 3D pictures to help myself better visualize my plan, and to see if it would even fit under the limitations of my case setup.
Explanation of what your are seeing:
-The yellow thing in the reservoir is a steel-wool type of material designed to let the water trickle down for noise reduction, and to aid in the separating of air from water.
-The water first splits off into two directions; One going to the CPU water block, and the other going to the GPU waterblock.
The water line from the CPU fows into the chipset block, while the line from the GPU routes into the HD water block.
These two then join up at the top and go into a stock "heatercore" radiator.
-Note that the radiator has two 120mm fans in a push/pull setup. It also has aluminum skirts designed to channel the maximum amount of air from the fans through the radiator.
-The radiator is not only mounted on the top because it is the most efficient for piping, but also because I can get rid of a little radiated heat through case conduction itself (although, it's only a steel case)
-The only fan left within the case is the one attached to the power source. The prudent thing to do would be to put an 80mm fan in the front of the case to be absolutely sure that the other components are getting the required amount of airflow, but my goal here is strip down as many noise making fans as possible.
-My hope is that the powersource fan will be good enough in terms of moving air within the case.
-Other notes: I will be attaching "ramsinks" to all the memory chips on my RAM, sound card(not pictured), network card, and GPU. I'm hoping that this will further allow me to get by without any stock case fans in my system.
General comments are welcome, but I have two specific questions off the top of my head:
1. What kind of GPH flow rate would my pump need to push through all this?
2. Is it possible that the Y-split setup would compromise the flow rate of the water tubes? (Ie. Might one tube be getting less or more water flow than the other?)
3. Would any stock case fans be necessary under the setup conditions specified?
4. Will a heatercore with the benefit of air skirts and a push/pull system be capable of dealing with all the heat generated from all four of these devices?